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Electroplating and Corrosion

CFDRC has developed state-of-the art simulation tools for analyzing and optimizing electroplating and corrosion processes. Our tools provide a platform for detailed analysis of any electrochemical system, with support for complex geometries and interactions between flow fields, chemical species transport, and electrical conduction. Our staff has extensive experience using these tools to develop new technologies by investigating:

  • Terminal contact effects on electroplating uniformity

  • Additive effects on plating rate and uniformity

  • Overpotential and related loss mechanisms

  • Species concentration distributions and related issues

  • and many other effects.

We are continually applying and improving our technology for analysis and development of electroplating processes and equipment, electrolytic processes for specialty and bulk chemical production, and corrosion mitigation technologies


Transient Film Thickness
During Copper Electroplating


Electric Potential Distribution in
'Fountain' Electroplating Cell


Terminal Effect in Copper
Electroplating on Silicon Wafer

 
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