|
CFDRC offers modeling expertise and tools for high-fidelity multi-physics
modeling, analysis, design, and optimization of Semiconductor Devices
and Packages: coupled 2D/3D Electro-Thermal Semiconductor Device Simulations
(various materials, high-power devices); Mixed-Mode (3Ddevice+SPICE) analysis;
coupled thermal-electrical-EM-mechanical performance analysis; deriving
compact/behavioral models from 3D numerical simulations.
Electronic Packaging
The Electronic Packaging Application Areas Include:
- Package/Die Level
- Thermal-Mechanical Modeling of Packages and Heat Sinks
- Thermo-Mechanical Design, BGAs, Wirebonds
- 3D Packages, 3D/Stacked Integrated Circuits
- Thermal Effects in Interconnects
- Active Liquid Cooling and Cryocooling
- Thermoelectric Cooling
- 2. Board Level
- Automated PCB thermal-mechanical-electrical modeling, analysis,
design
- System-Level Cooling and Active Control
- Automated Model Generation from CAD Formats or EDA Layouts
- System Level Cooling and Intelligent Thermal Management
Thermal Management Solutions
CFDRC offers expertise and customized multiphysics software for integrated
thermal, fluid-flow, and thermal stress/deformation analysis of electronic
devices and packages, with interfaces to EDA and CAD. We provide design
and optimization templates for all types of passive and active cooling
devices, including heat sinks, liquid cold plates, heat pipes, thermoelectric
coolers, spray cooling, and cryocooling systems. We also provide design
analysis services, prototype fabrication, experimental testing, and customized
parametric product design tools.
Thermal Management Application Areas Include:
- System-Level Cooling and Active Control
- Automated Model Generation from CAD Formats or EDA Layouts
- System Level Cooling and Intelligent Thermal Management
- Board Level Thermal Design
- Automated PCB, PWA thermal modeling, analysis, design
- Package/Die Level Thermal Management
- Thermal Modeling of Packages and Heat Sinks
- Thermo-Mechanical Design, BGAs, Wirebonds
- 3D Packages, 3D/Stacked Integrated Circuits
- Thermal Effects in Interconnects
- Active Liquid Cooling and Cryocooling
- Thermoelectric Cooling
- Device Level Electrothermal Modeling
- Thermal effects in Devices (CMOS, IGBTs,…)
- Thermal Effects in Optoelectronics and Photonics
- Nano Thermal Engineering
CFDRC also has experimental facilities and expertise to conduct thermal-electronic
measurements for testing electronic cooling equipment to support model
analysis and to determine system characteristics.
|
Computer Box Flow and Thermal Analysis
|
