CFDRC scientists and engineers have significant expertise in simulating and analyzing electroplating systems for materials processing in the electronics industry, including the effects of complex multi-species electro-chemistry. This expertise can be readily applied to more traditional electroplating and corrosion applications, as well.

Physical Models:

Physical Models :
Electroplating and corrosion are modeled in 1-D, 2-D, and 3-D by solving systems of equations for the electrochemical reactions in the solution and at the deposition/etch surface. These equations are solved in conjunction with conservation equations for mass, momentum, species, and energy (electrical and thermal). This fundamental approach enables the analysis of

• Multi-species transport, multi-step surface reactions, and multi-species electrochemical deposition
  
• The effects of additives and pulse/pulse-reverse plating on deposition uniformity
  
• Tertiary, secondary, primary, and limiting current distributions on electrochemical reaction surfaces
  
• High-aspect ratio seed layer and transient growth of deposited layers on insulating substrates. (Semiconductors)
  
• Heat sources including Joule heating and heat generated via electrochemical reactions
  
• The coupled effect of flow, heat transfer, species conservation, and electrical conduction analysis
  

Transient Deposition of
Copper via Electroplating

Configuration of a Typical
Electroplating Fountain Reactor

Prediction of Electrical
Potential Distribution

Predictions of Transient Layer Profiles & Their Comparison to Published Data